Parametric Optimization of Micro Ultrasonic Drilling of Quartz Based on RSM

Abstract

Micro ultrasonic machining is the process for micro hole drilling on hard and brittle materials like ceramic, glass, quartz, silicon, etc. Quartz has wide applications in microelectromechanical systems (MEMS), lenses, pressure and flow sensors, and micro-optical systems. In the present research work, optimization of the process parameters for responses such as material removal rate, overcut, and taper angle during micro ultrasonic drilling has been performed utilizing the developed empirical relationship between the responses and process parameters. Three different process parameters— power rating, abrasive slurry concentration, and tool feed rate were considered for this experimental investigation. The parametric studies have also been made based on response surface plot. Based on multi-objective optimization, optimal parametric setting for maximum material removal rate, minimum overcut and minimum taper angle have been obtained.