Abstract
Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of the multidomain models commonly used for simulation of their operation. The authors investigated white power light-emitting diodes soldered to Metal Core Printed Circuit Boards (MCPCBs). The tested devices were placed in a light-tight box on a cold plate and their cooling curves were registered for different diode heating current values and various preset cold plate temperatures. These data allowed the computation of optical and real heating power values and consequently the generation of compact thermal models in the form of Foster and Cauer RC ladders. This also rendered possible the analysis of the influence of the considered factors on the compact model element values and their parametrization. The resulting models yield accurate values of diode junction temperature in most realistic operating conditions and they can be easily included in multidomain compact models of power light emitting diodes.
Highlights
Power light emitting diodes are nowadays rapidly replacing traditional incandescent bulbs and they are ever more and more frequently being used in numerous lighting applications [1]
The devices investigated in this paper were commercially available white power LEDs from the
The measurements of the optical power emitted by the investigated device, as stated previously, allowed the computation of the heating power and the application of the Network Identification allowed the computation of the heating power and the application of the Network Identification by by Deconvolution (NID) thermal analysis method
Summary
Power light emitting diodes are nowadays rapidly replacing traditional incandescent bulbs and they are ever more and more frequently being used in numerous lighting applications [1]. Ainstandardized are the DELPHI style ones, are main goal of the research this paperform wasoftoCTMs develop a methodology forwhich the generation of boundary condition independent and do not disclose any proprietary information, but again the data parametrized ladder models, which could be applied in a wide range of LED operating and cooling necessary to generate them can be provided only by device manufacturers [13,14] Another form networks of CTMs aremight the RC be ladder models which canmore be obtained directly from system dynamic responses using different model orderbetween reductionmultiple methods [15,16]. The cooling curves simulated with these models are compared with the measured ones
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