Abstract

This article concerns the problem of light-emitting diode (LED) compact thermal modeling. The methods currently used to generate such models either require some proprietary information from a device manufacturer or the resulting model element values that do not have any physical interpretation. The methodology proposed in this article allows the generation of compact thermal models based only on measurements of device dynamic temperature responses. The experimental procedure to generate the models is illustrated here with an example of color LEDs. The experiments demonstrated that it is possible to obtain in this way compact models that for various colors of emitted light and in different cooling conditions produce accurate simulation results. Furthermore, the compact model element values can be related to specific regions in the real structures.

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