Parameter analysis and optimization of a heat sink for cooling intelligent power modules based on Taguchi method

Abstract

The stability of the intelligent power module has a very significant impact on the operation of the air conditioner. In this paper, a prototype experimental platform is built to verify the feasibility of the simulation results. Next, the thermal performance and flow characteristics of the heat sink are analyzed, including single-factor analysis and analysis of interactive effects. The results show that a smaller pipe diameter can reduce the maximum temperature of intelligent power modules, TIPM, but it will increase the pressure drop, ?P, and entropy generation. The thickness of the heat sink plate and the height of the protruding table have an interactive effect on the TIPM. Then the sensitivity of the TIPM and pressure drop to different parameters was analyzed, and the contribution ratio of the pipe diameter to both the TIPM and pressure drop was the largest. Finally, the optimal combination of parameters was obtained to minimize both the TIPM and pressure drop. Compared with the original structure, the TIPM decreased by 3.98 K.