Parallel Multilevel Cell STT-MRAMs for Optimized Area Energy and Read–Write Operations

Abstract

Spin-transfer torque (STT) magnetic random access memory (MRAM) is considered as a promising candidate for the next generation embedded memory applications. The advent of a perpendicular magnetic anisotropy-based magnetic tunnel junction (PMTJ) device has made the STT-MRAM viable for low-power high-density on-chip memory architectures. However, intense research efforts are still required to optimize the single-level cell and multilevel cell (MLC) STT-MRAMs in terms of area, energy, and read–write operations at ultralow power supply voltages. In this paper, a parallel MLC (pMLC) STT-MRAM (20–50 nm) is proposed to provide smaller footprint area, energy efficient, and optimized read–write operations with very low failure probabilities at the supply voltage of 1 V. These designs utilize high- ${k}$ gate dielectric gate-all-around silicon nanowire-based vertical NMOS transistor as a switching device. The PMTJ device is modeled using Verilog-A. The HSPICE simulation results affirm the suitability of pMLC designs, e.g., 3-bit pMLC design exhibits, switching error probability much less than 10−9, and average write energy of <2 pJ with minimum cell-area at the pulsewidth of 10 ns.