Abstract
AbstractThis paper reviews the contact mechanics between the surface of a wafer and the asperity of the polishing pad for CMP from basic asperity such as spherical, rectangular, and conical shapes to more general asperity with a height distribution. This paper also proposes a practical method to bridge a measured profile of pad asperity in microscopic scale to a set of simple parameters which describe the elastic behavior for CMP process simulation in larger scale. We show a scalable CMP simulation using the proposed pad asperity parameters.
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