Abstract
An advanced astrometric sensor array (AASA) of charge-coupled device (CCD) chips was constructed using thin-film hybrid multichip packaging technology for operation at -140 degrees C. A series of AASA prototypes were fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to determine materials, fabrication processes, and structures suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the sensors. The AASA samples were evaluated by thermal cycling (27-138 degrees C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented. >
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