Packaging Optoelectronic/VLSI Chip Using Polarization Selective Computer Generated Holograms

Abstract

Integration of microlenses with III-V devices such as lasers and detectors has been previously demonstrated1,2,. Integration of the optics directly with the optoelectronic (OE) devices allows compact and reliable packaging for optical interconnect applications. The optical signals are routed to photodetectors and transmitted from the modulators or laser devices using arrays of diffractive optical elements (DOEs) or micro-optics components3. In general, these optical input and output signal paths need to be different, which, in turn, implies that the corresponding DOE or micro-optics arrays must be capable of providing dual functionality in implementing the communication links to and from the VLSI array with optical I/Os. However, since the conventional DOE or micro-optics components do not possess this dual functionality, additional components such as polarization beam splitters are required to separate the input and the output signals4. In this paper, we present the first integration of beam-forming computer generated holograms (CGH) with optoelectronic (I/O) devices flip-chip bonded to CMOS VLSI electronics, and the first integration of a polarization-selective CGH with an optoelectronic device.