Abstract
The commercial market for telecom components has had an increasing demand for laser transmitter packages with higher functionality and smaller form factor. These higher levels of integration require an optical bench platform that can incorporate multiple active and passive elements and withstand stringent reliability requirements. Furthermore, the laser package must be compatible with high-volume manufacturing. We have developed an optical platform for building hybrid (multiple active elements) optoelectronic devices in a stable, hermetically sealed package. Two novel approaches to optical packaging have been developed: a localized laser soldering process and a flexure-based lens mount with large dynamic range. We present the optical bench and component design and the results of engineering reliability testing of the assembled package.
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