Abstract
The wide field of MEMS and Sensor technologies adds numerous aspects to the classical world of semiconductor industry. MEMS-specific requirements impact wafer technologies, assembly and electrical interconnection both on package and system level. Reliability engineers have to cope with materials, which are new to semiconductor environments. Furthermore, degree and level of integration, as well supply chains might have to be reviewed. This paper elaborates on novel flavors which the MEMS- and Sensor features add to the semiconductor industry. A focus is put onto the field of packaging. Striving for low stress packages is the traditional field of sensor packaging development, because package-induced mechanical stress typically deteriorates the performance of a sensor. On the other hand, specific case studies demonstrate, how packaging can as well substantially contribute to the performance of a sensor device.
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