Abstract
Summary form only given. The increase of the application of film assisted molding technology confirms the importance of this new encapsulation technology for the semiconductor industry. The introduction of film in the mold has enabled a process technology using standard pellets that addresses the packaging of advanced silicon devices. The new challenge is the encapsulation of MEMS or sensor packages. MEMS packages often need the access to the environment to make its measurements. FAM technology is an enabling material and process technology that addresses the packaging technology in keeping the functional area open during the encapsulation. FAM technology is also the solution for clean room molding. By carefully analyzing the features of the FAM technology it is possible to manufacture economically advanced packages in high volume production, achieving the highest device reliability. The presentation will explore the possibilities and the benefits that FAM can bring to the encapsulation of MEMS packages.
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