Abstract
In order to realize small package size, uniform performance and high manufacture efficiency, a chip scale packaging (CSP) technology has been developed by controlling the thickness of the phosphor film in this paper. Five CSP LEDs with different thicknesses of 4 side faces are prepared. Optical tests and thermal simulations were carried out to evaluate the performance of the five samples. The measurement results indicate that: 1) When the absorption of the blue light reached a certain extent, the luminous flux and correlated color temperature gradually decreased with the increase of the thickness of the film; 2) the color temperature of the CSP LED will reach the best uniformity when the ratio of thickness of top film to that of side film is close to 2:1; 3) when the ratio of thickness of top film to that of side film is not less than 2:1, the effective light angle can reach about 160°; 4) the thermal management for prepared CSP samples shows a slight decrease in temperature as the side film's thickness increases; 5) the aging test result shows that the thinner the package thickness is, the stronger the aging resistance will be.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.