Abstract

This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased arrays in emerging communication applications. Implementations of state-of-the-art silicon-based phased arrays below 100 GHz are discussed, with emphasis on array architectures for scaling, antenna integration options, substrate materials and process, antenna design, and IC-package codesign. Opportunities and challenges to support phased array applications beyond 100 GHz are then presented, including emerging packaging architectures, interconnect characterization requirements, thermal management approaches, heterogeneous integration of multifunction chiplets, and novel antenna technologies.

Highlights

  • Mobile communication technologies have evolved significantly in the past several decades

  • Frequency utilization of millimeter-wave bands and improved spectrum utilization are among the key attributes of 5G new radio (NR) technology

  • There is a wide variety of substrate technologies that have the appropriate properties to integrate antennas and RFICs [22], including, but not limited to, conventional copper-clad printed circuit board (PCB) with low Dk and Df dielectric, low temperature co-fired ceramic (LTCC), quartz-on-silicon, thin films on glass, wafer-level fan-out package, and multi-layer organic laminate (e.g., liquid crystal polymer (LCP) package, build-up package, etc.)

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Summary

INTRODUCTION

Mobile communication technologies have evolved significantly in the past several decades. We first review packaging and antenna integration work for Si-based phased array demonstration examples at frequencies below 100 GHz. In Section II, array architectures for scaling, substrate material and process, as well as co-design considerations between antenna and RFIC, are discussed in detail. These functions are often partitioned into a few different kinds of ICs to utilize the most appropriate process technology for each, as shown. In this case, 16 dual-polarized antennas are integrated in a unit package module. The array uses IF beam forming with the combining tree implemented on the PCB

SUBSTRATE MATERIAL AND PROCESS FOR PACKAGING
ANTENNA AND RFIC CO-DESIGN CONSIDERATIONS
CONCLUSION
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