Abstract
A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multi-wavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of < 1 MHz were measured.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have