P‐76: Development on the Improvement of Low Temperature Folding Performance of AMOLED Modules

Abstract

Since 2019, more than 20 foldable products have been released, and the categories released increased year by year. It can be seen that foldable products are increasingly favored by consumers and mobile phone manufacturers due to their advantages in expandable display size. It is expected that there will be explosive growth in the future. However, there are still some technical challenges for foldable product, such as waviness, poor impact/press resistance, and low temperature folding failure. This paper focuses on the research on improving the low temperature folding reliability of AMOLED modules. The difficulties of folding, the main failures and improvement methods, and the analysis of bending force in low temperature are introduced. Finally, the reliability for 50k times at ‐30℃ of out‐folding R 5mm, in‐folding U form R 1.5mm, in‐folding water drop form R 2mm are achieved.