Abstract
We report on a robust metallization scheme ideal for interconnects required in flexible display applications. Multi-layered metal interconnects including a granular discontinuous ductile indium layer, have been deposited on a variety of compliant substrates to confirm that there is a minimal change in resistance even when subjected to large mechanical strains and repeated low-strain fatigue loading. Initial analysis of deformed films also suggests there is a possibility for a self-healing process. A finite element analysis (FEA) model of the thin-metal film/polymer substrate structure, also confirms the stretchability of the granular indium islands observed to be bridging the cracked regions in the underlying conductive layers.
Published Version
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