Abstract
We propose a Thin-beam Directional X' tallization (TDX) method, based on a high power, high repetition rate XeF excimer laser source and special optics, to produce a long, narrow (∼ 5 micron) beam with sharp edge slope. We present experimental results from a prototype TDX system that demonstrates very uniform directional laterally grown poly-Si films without any grain boundary protrusions.
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