P‐39: Detachment of Polymeric Substrate Using CO2 Point Laser for Large‐Area Flexible Display: An Alternative Approach for Laser Lift‐Off

Abstract

We present a new method of detaching flexible substrate from rigid carrier wafer using a CO2 point laser. A laser lift‐off detachment is mostly used detaching method in the fabrication of large‐area flexible display; however, illumination and thermal stresses on electronic devices due to the laser beam energy are still problems. Our approach using a point laser does not impose laser‐induced stress on electronic components. To minimize the de‐bonding stress, we precisely controlled the adhesion between flexible substrate and carrier wafer by simple modification on the carrier surface. A flexible indium‐tin‐oxide film exhibited almost no change on its resistance value after detachment.