Abstract
AbstractIn this work, we propose the subgap density‐of‐states (DOS) based device‐circuit co‐design platform for solution‐processed organic integrated circuits. For the circuit simulation, analytical I‐V and C‐V model were established from experimentally extracted DOS parameters, incorporated into HSPICE via Verilog‐A, and verified by comparing the simulation result with the measured characteristics of inverter integrated with solution‐processed polymer‐based organic thin‐film‐transistors. Furthermore, as the case study, it was shown by using our well‐calibrated simulation platform that the pass‐transistor type logic was potentially promising in low‐power and high‐speed solution processed organic integrated circuits.
Published Version
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