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https://doi.org/10.1002/sdtp.17962
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Cite Publication Date: Jun 1, 2024 |
Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the method of process optimization.
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