Abstract
Camera under panel (CUP) technology is essential for truly full‐screen display in smartphones. We present here an excellent design used on the Mi Mix 4 phone by shrinking the pixel size and increasing pixel brightness in the CUP area. Considering the different degradation rates of TFT devices between active area and CUP area, a source‐contacted metal isolation layer (MIL) under the thin‐film transistors (TFTs) is employed to obtain superior electrical reliability. This MIL technology can shield mobile charges within polyimide (PI) substrate and help improve initial current drop level of TFT circuit, thus achieving a uniform display quality and a seamless viewing experience. It was also found that long‐term image sticking time can be significantly reduced to less than 3min. These results may lead to widespread applications in the field of flexible displays.
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