Abstract
The inkjet‐printed organic‐inorganic light emitting diode (HyLED) employing metal oxide‐based hole injection layer (HIL) is demonstrated. The metal oxide HIL is built by the single step of sputtering during the backplane fabrication process, and the hole transport layer and the emission layer are constructed by sequential inkjet printing processes. The effects of metal oxide HILs in both inkjet‐printed HyLED and vacuum thermal evaporation‐based HyLED are studied, and it is found that the metal oxide HIL shows the possibility of improving the hole injection only in our inkjet‐printed HyLEDs not in our thermal evaporated HyLEDs. The metal oxide HIL in our inkjet‐printed HyLED is also helpful for reducing the manufacturing cost and enhancing the yield by reducing the number of inkjet process for constructing organic functional layers.
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