Oxygen generation in anodized Ta–Cu alloys

Abstract

Comparison is made of the influences of copper in the development of amorphous anodic films on Ta-Cu alloys, containing up to 57 at.%Cu, in ammonium pentaborate electrolyte at 293 K. The various films are based on tantala, with low concentrations of copper, relative to those of the alloys, since copper species migrate through the films more rapidly than Ta5+ ions and are lost to the electrolyte on reaching the film surface. Of particular interest, film growth on Ta-1.5at.% Cu alloy at 1, 0.1 and 0.01 mA cm−2 proceeds with generation of oxygen, which is contained in nanoscale bubbles within the oxide. Bubbles are more numerous as the current density decreases. In the case of Ta-12at.% Cu and Ta-57at.%Cu alloys, the films are flawed extensively by more numerous oxygen bubbles, which are present mainly in the outer parts of the anodic films; oxygen production and film damage due to the bursting of bubbles limit the anodizing voltage to relatively low values. It is suggested that copper species modify the electron levels, and possibly structure, of the tantala-based films, thereby facilitating oxygen generation within the bulk film by oxidation of O2- ions of the oxide.