Abstract
In this study, the sintering of Ag sheets on bare Cu substrate in an air atmosphere without oxidation was achieved by developing a uniform pressure and oxidation inhibition bonding process. Bare Cu substrates and Ag plated dies were bonded with a nano scaled porous Ag sheet at 250 °C and 280 °C in an air atmosphere using an oxygen-blocking pressure bonding system. Oxygen-free Ag nanoporous sheet bonding achieved over 39 MPa strength in air, with up to 30 % bonding ratio increase as temperature rose, depending on necking length and connection. The microstructure of the Ag sintered layer was further investigated by transmission electron microscopy (TEM) analysis.
Published Version
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