Abstract
The oxidation characteristics of Al–Mo alloy films (50 nm) deposited on Cu as a metal capping layer have been examined by varying the alloy composition. Cu oxidation from the surface and Cu out-diffusion toward the surface are well suppressed when using Al–Mo alloy with a Mo-rich composition. By using an Al15Mo85 alloy film, in which fine crystalline grains of AlMo3 are dispersed in an amorphous phase of the alloy, a well-separated layer configuration of oxide/Al–Mo alloy/Cu without excess Cu diffusion and/or preferential Al oxidation in the alloy layer is realized upon oxidation at 350 °C for 1 h in air. It is revealed that Al15Mo85 alloy films are a useful candidate material of a metal capping layer for Cu interconnects.
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