Abstract
As a new integration and packing technology, the low temperature co-fired ceramic (LTCC) technology attracts close attention for its excellent advantages such as high speed transfer characteristics, high reliability, miniaturization, etc. However, the sintering shrinkage of LTCC substrate always affects the practical effect of it. In this paper, the material characteristics, methods to control the sintering shrinkage of LTCC substrate and the development trend for the control methods are mainly overviewed. It is contributed to the research and application of LTCC technology.
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