Over 10 Gbps/ch compact active interposer module for high-speed and high-density chip level optical interconnects

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This paper presents prototype demonstration of the fabricated active interposer module. The fabricated active interposer is composed of 32 ch transmitter and 32 ch receiver, built on a compact interposer substrate, each of them alternately arranged eight by eight channels with an optical I/O port having a pigtail ribbon fiber. The transmitter unit is comprised of a pair of 4 ch VCSEL array flip chip bonded onto a waveguide coupler of the I/O port and a pair of 4 ch driver IC mounted on the interposer substrate. The receiver unit is similarly constructed. This device has potential application to future high performance chip level optical interconnects over 10 Gbps/ch.