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https://doi.org/10.1299/jsmeatem.2015.14.32
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Cite Publication Date: Jan 1, 2015 | |
 Citations: 1 |
OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)
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