Abstract

Diamond and graphene are considered to be one of the most promising thermal interface materials (TIMs) for electronic devices benefited from their highest thermal conductivity in the natural world. However, orientated fabrication of high thermal conductivity diamond and graphene hybrid arrays with three dimensions (3 D) thermal conductive networks are still problematic. Here, we used a unique one-step microwave plasma chemical vapor deposition, n-butylamine, as the liquid source to prepare a novel high thermal conductivity 3 D vertical diamond/graphene (VDG) hybrid arrays films. The orientated 3 D thermal conduction path of the VDG is regulated by the growth temperature, and the through-plane thermal conductivity value of the VDG700 films up to 97 W m−1 K−1. In the actual TIM performance measurement, the system cooling efficiency with our VDG as TIM is higher than the state-of-the-art commercial TIM, demonstrating the superior ability to solve the inter-facial heat transfer issues in electronic systems.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call