Abstract

The possibility to deposit purely organic and hybrid inorganic–organic materials in a way parallel to the state-of-the-art gas-phase deposition method of inorganic thin films, i.e., atomic layer deposition (ALD), is currently experiencing a strongly growing interest. Like ALD in case of the inorganics, the emerging molecular layer deposition (MLD) technique for organic constituents can be employed to fabricate high-quality thin films and coatings with thickness and composition control on the molecular scale, even on complex three-dimensional structures. Moreover, by combining the two techniques, ALD and MLD, fundamentally new types of inorganic–organic hybrid materials can be produced. In this review article, we first describe the basic concepts regarding the MLD and ALD/MLD processes, followed by a comprehensive review of the various precursors and precursor pairs so far employed in these processes. Finally, we discuss the first proof-of-concept experiments in which the newly developed MLD and ALD/MLD processes are exploited to fabricate novel multilayer and nanostructure architectures by combining different inorganic, organic and hybrid material layers into on-demand designed mixtures, superlattices and nanolaminates, and employing new innovative nanotemplates or post-deposition treatments to, e.g., selectively decompose parts of the structure. Such layer-engineered and/or nanostructured hybrid materials with exciting combinations of functional properties hold great promise for high-end technological applications.

Highlights

  • Many high-end technologies rely on our capability to fabricate thin films and coatings with on-demand tailored compositions and architectures in a highly controlled way

  • The atomic layer deposition (ALD) technique is capable of producing highquality nanometer-scale thin films in an atomic layer-by-layer manner

  • The aim of this review is to provide a thorough investigation of the various thin films deposited by taking advantage of the currently strongly emerging molecular layer deposition (MLD) technique, including pure organic thin films, hybrid inorganic–organic thin films and their mixtures and nanolaminate structures

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Summary

Introduction

Many high-end technologies rely on our capability to fabricate thin films and coatings with on-demand tailored compositions and architectures in a highly controlled way. The atomic layer deposition (ALD) technique is capable of producing highquality nanometer-scale thin films in an atomic layer-by-layer manner. Compared with other advanced gas-phase thin-film deposition techniques, ALD has several distinct advantages: The films can be deposited with a great control over the film. Thickness and they are pinhole free, dense and uniform, and conformal even when deposited on complex threedimensional (3D) structures. These features make ALD a method of choice for nanotechnology, for both material synthesis and device fabrication. The technology spectrum in which ALD can be utilized is extremely wide, including microelectronics, catalysis, energy applications and protective/barrier coatings

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