Abstract
The low thermal conductivity coefficient (λ) of polyimide (PI) films are limiting their application in high-power electronic equipment, and the disordered alignment of fillers discourage efficient improvement of λ for PI-based composite films. Herein, polyethylene glycol trimethylnonyl ether is used to perform liquid crystalline modification on graphene fluoride (LC-GeF) to achieve ordered alignment. Intrinsically thermally conductive liquid crystalline PI (LC-PI) matrix is utilized to fabricate thermally conductive LC-GeF/LC-PI composite films. In-plane λ (λ∥) and through-plane λ (λ⊥) of 15 wt % LC-GeF/LC-PI composite films reach 4.21 and 0.63 W/(m·K), 446.8% and 320.0% higher than λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of normal PI films, 99.5% and 96.9% higher than λ∥ (2.11 W/(m·K)) and λ⊥ (0.32 W/(m·K)) of LC-PI films, also higher than 15 wt % GeF/LC-PI composite films. Additionally, LC-GeF/LC-PI composite films possess more excellent insulating, mechanical, and thermal properties than GeF/LC-PI composite films.
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