Abstract
Array surface active devices such as self-electrooptic effect devices (SEEDs) and surface emitting lasers (SELs) are being considered increasingly for parallel interconnection technology. Because these are optical devices, it is necessary to provide alignment in the micron to submicron range between optical elements, such as microlenses and the SEEDs. Here we describe a packaging scheme that uses solder self-alignment to provide both electrical interconnection and passive optical alignment during a single assembly operation. Also, we have designed a unique heat sink to help maintain uniform temperature across all active devices, which is necessary for proper device functional operation.
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