Optimizing process parameters of hot-bar soldering process through quality function deployment and Taguchi method

Abstract

As quality values failed to meet customers’ requirements when the hot-bar soldering process (HBSP) was first introduced in the electronic manufacturing service (EMS) company, it is the intention of this study to combine quality function deployment (QFD) and the Taguchi method to analyze the produced quality characteristics and to optimize the process parameters. The product from HBSP is a gate board that transmits vertical signals in thin film transistor liquid crystal display (TFT-LCD) modules. To produce a gate board through HBSP, a film of flexible printed circuit (FPC) is soldered onto the pad of a printed circuit board (PCB) with the hot-bar (HB) which is heated by a pulse heater. When performing a problem analysis, the strength of the solder joints is considered a response value of quality characteristics for the process of HBSP. The critical factors are then identified via the Taguchi method. The results of this study will indicate whether or not the quality of the gate board can be improved significantly and thereby satisfy customers’ requirements.