Abstract
The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed. Detailed theoretical analysis of the thermal resistance for the microchannel heat sink is obtained. The thermal resistance minimum is achieved by the heat sink structure optimization, the result of theoretical analysis is simulated by MATLAB software. The result shows that: the system acquired the best heat dissipation effect, when the total size of the radiator is fixed, the width of the cooling channel is 0.1mm, and the cooling water flow rate is 1 m/s, the minimum of thermal resistance is 0.019w/°C.
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