Abstract
In this paper the optimized structural parameters of the multilayer high-speed MMICs are obtained to minimize the crosstalk of the orthogonal microstrip lines in 1-20 GHz frequency range. The crosstalk is calculated by lumped circuit model of the cross-region using quasi-static methods and solving the related coupled integral equations. The spectral domain Green's Function of the structure has been determined by utilization of the real-valued images technique. By using predetermined lumped circuit model, the effects of the physical parameters such as dielectric constant, height and number of layers and width of the traces have been investigated on the coupling factor of crossing interconnections.
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