Optimization of laser-based glass frit bonding for optoelectronic packaging using response surface methodology

Abstract

Laser-based glass frit bonding presents considerable advantages, including fast bonding speed and minimal thermal impact, showing significant application prospects in the packaging of temperature-sensitive optoelectronic devices. In this study, the individual effects of critical process parameters on bonding performance have been investigated through single-factor experiments. Response surface methodology is employed to design experiments systematically for the laser-based glass frit bonding process, focusing on exploring the interactive effects among these process parameters. The Box-Behnken design method is implemented for experimental setup, and a regression model has been developed to analyze the resulting data. Analysis of variance, 3D response surface plots, and contour plots are conducted to comprehensively evaluate the interaction effects of parameters on the bonding seam width and strength. The mathematical model is validated and an optimal combination of process parameters is identified, which significantly enhances the bonding quality. The optimized process parameters are also applied for the laser bonding of square-shaped seam to validate the feasibility of the optimized results and to promote the engineering application of glass laser-based glass frit bonding technology in microelectronic component packaging. Inspection of the bonded specimens shows excellent formation quality of the square-shaped bonding seams, confirming the methodology’s effectiveness in advancing optoelectronic packaging technology.