Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects

Abstract

Recent studies show also how the evaluation of mixed mode interface delamination phenomena, classical strength hypotheses along with fracture mechanics approaches and thermal fatigue estimation of solder joints can simultaneously be taken into account. Here such an integrated approach is coupled with optimization algorithms towards a thermo-mechanical reliable design. At the same time, the attention is also turned to reach robustness against scattering model parameters-scattering of geometry as well as of materials properties, in particular. The assumption that some variables of the model are stochastic parameters leads directly to the consequence that all results show also scattering characteristics. The paper explains the methodology and results towards a robust design, to emphasize the potential of the utilized approach. Exemplarily, an underfilled flip-chip assembly based on reflow soldering and a non-underfilled Flip-Chip assembly with thermo-compression bonded metal-metal interconnections on low-k will be examined with regard to their board level reliability and robustness.