Abstract

Smooth (< 0.5 nm rms) and subsurface damage-free (010) β-Ga2O3 was achieved with low-pressure chemical mechanical polishing. An applied pressure of 1 kPa along with colloidal silica and poromeric polyurethane polishing pads rotating at 30 rpm was found to be the optimal polishing parameters for (010) β-Ga2O3. Using higher pressures typically employed in the current literature induced subsurface damage in the substrates. Diffuse scatter intensity of triple-axis x-ray rocking curves was used to determine the presence of subsurface lattice damage, which was quantified by measuring peak widths below the half maximum (i.e., FWXM where X < 0.5). The initially rough surfaces of (010) β-Ga2O3 substrates due to wafer slicing and grinding were lapped and polished. A 5 μm Al2O3 slurry followed by a 0.3 μm Al2O3 slurry was used as the primary lap material removal step. The material removal rates were ∼20 and ∼9 μm/h, respectively. Then, chemical mechanical polishing was performed using colloidal alumina followed by colloidal silica. The removal rates were ∼1.3 and ∼0.4 μm/h, respectively. Only colloidal silica showed the complete removal of subsurface damage. The final (020) β-Ga2O3 rocking curve FWHM was ∼13″ and FW(0.001)M was ∼120″, which matches the widths of commercially available pristine (010) β-Ga2O3. A final cleaning step using dilute bleach and dilute citric acid to remove residual silica slurry particles from the surface was demonstrated.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call