Abstract
Mixed colloidal silica particles as abrasive in slurries have been proposed to improve and realize a high removal rate and smooth surface without subsurface damage, on sapphire chemical mechanical polishing (CMP). Mixed silica particles were fabricated by different sizes of nano-silica particle with the range of pH 7-13. The characteristics of the mixed large and small silica particles has been observed. Dynamic light scattering (DLS) spectra results revealed that the structure of the mixed particle, the small particle at the size of 4 nm are adsorbed on the large silica particles and increase in the size of the abrasive particles. Furthermore, we found that pH value affected to abrasive particle size. In these cases, our polishing tests results show that material removal rate (MRR) of the sapphire CMP totally increase. This confirmed that mixed particles could produce a higher MRR than single colloidal silica slurry. Finally, the mechanism of sapphire removal was discussed.
Published Version
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