Abstract
This work presents a systematic study to achieve the best result of having high breakdown voltage with high-frequency operation for a 150 nm GaN HEMT device (fabricated) using different field plate engineering techniques. The device breakdown voltage, cut-off frequency and maximum frequency should be high for high power and high frequency applications. The conventional device has a lower breakdown voltage but good cut-off and maximum frequency ranges. Field plate engineering has been done for breakdown improvement. However, the device's frequency operation is hampered by the typical source and gate field plate. As a result, an Air bridge source connected field plate and floating gate field plate architectures are explored and investigated. The best outcome is obtained with air bridge source connected field plate with VBOff = 100 V maintaining the cut-off frequency and maximum frequency at 29.8 GHz and 50.3 GHz respectively which is suitable for high power and high frequency applications.
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