Abstract

As a new non-destructive testing technology, X- ray real-time imaging detection technology has been put into practical use in the field of industrial product testing. With the printed circuit boards, integrated circuits increasingly integrated, sizes of the circuit feature are smaller and smaller. The spatial resolution of X-ray imaging systems are increasingly high requirements on the circuit board defect detection. However, the spatial resolution of the existing system can not meet the need for high-resolution imaging. This paper proposes an approach to introducing international advanced optical microscanning technology into existing systems to improve the spatial resolution, thus completing the high-resolution X-ray imaging of fine structure. The definition, the component of the system, working principle, the microscanner and other theory were introduced. Moreover, the successful development of microscanning system can also be applied to other systems to improve the resolution, these systems include the X-ray imaging systems, visible imaging systems, infrared thermal imaging system.

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