Abstract
The optical characteristics of a multi-channel hybrid integrated light source were described for an optical interconnection with a bandwidth of over 10 Tbit/s. The power uniformity of the relative intensity of a 1000-channel light source was shown, and the minimum standard deviation s of the optical power of the 200 output ports at each 25-channel laser diode (LD) array was estimated to be 0.49 dB. This hybrid integrated light source is expected to be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.
Highlights
The overall interchip bandwidth in central processing units (CPUs) used for high-end servers is expected to reach the 10-Tbit/s level by the late 2010s
We fabricated a light source with 1000 output ports [8] in which the silicon optical waveguides were split into eight waveguides by using cascaded 1 ×4 and 1 ×2 multimode interferometer (MMI) splitters and in which five laser diode (LD) array chips with 25 channels were mounted on a silicon waveguide platform by multichip bonding [4] (Figure 1)
We described the optical characteristics of a multi-channel hybrid integrated light source for an optical interconnection with a bandwidth of over 10 Tbit/s
Summary
The overall interchip bandwidth in central processing units (CPUs) used for high-end servers is expected to reach the 10-Tbit/s level by the late 2010s. We previously proposed a photonics-electronics convergence system and we demonstrated a silicon optical interposer achieving a high bandwidth density up to 30 Tbps/cm2 [2] In this system, the integrated continuous wave (CW) light source on the interposer must be multi-channel and have high density. We describe optical characteristics of the 1000-channel hybrid integrated light source for ultra-high-bandwidth optical interconnections. We fabricated a light source with 1000 output ports [8] in which the silicon optical waveguides were split into eight waveguides by using cascaded 1 ×4 and 1 ×2 multimode interferometer (MMI) splitters and in which five LD array chips with 25 channels were mounted on a silicon waveguide platform by multichip bonding [4] (Figure 1).
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