Abstract
We have demonstrated an on-wafer fabrication process for AlGaN-based UV-C laser diodes (LDs) with etched mirrors and have achieved lasing for 100 ns pulsed current injection at room temperature. A combined process of dry and wet etching was employed to achieve smooth and vertical AlGaN (11¯00) facets. These etched facets were then uniformly coated with a distributed Bragg reflector by atomic layer deposition. A remarkable reduction of the lasing threshold current density to 19.6 kA/cm2 was obtained owing to the high reflectivity of the etched and coated mirror facets. The entire laser diode fabrication process was carried out on a whole 2-in. wafer. We propose this mirror fabrication process as a viable low-cost AlGaN-based UV-C LD production method that is also compatible with highly integrated optoelectronics based on AlN substrates.
Highlights
Scitation.org/journal/apl a vertical, dry-etched facet, which results in a low mirror quality, and (ii) difficulty in depositing a high-quality, distributed Bragg reflector (DBR) on the etched facet
We have demonstrated an on-wafer fabrication process for AlGaN-based UV-C laser diodes (LDs) with etched mirrors and have achieved lasing for 100 ns pulsed current injection at room temperature
The entire laser diode fabrication process was carried out on a whole 2-in. wafer. We propose this mirror fabrication process as a viable low-cost AlGaN-based UV-C LD production method that is compatible with highly integrated optoelectronics based on AlN substrates
Summary
Scitation.org/journal/apl a vertical, dry-etched facet, which results in a low mirror quality, and (ii) difficulty in depositing a high-quality, distributed Bragg reflector (DBR) on the etched facet. We have demonstrated an on-wafer fabrication process for AlGaN-based UV-C laser diodes (LDs) with etched mirrors and have achieved lasing for 100 ns pulsed current injection at room temperature.
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