Abstract
This paper presents an original methodology and a test bench for active power cycling and on-line junction temperature measurement during power cycling of power devices embedded in PCB. This method is based on the use of the ratio between forward voltage and forward current variations (∆VF,∆IF) during conduction period to estimate the thermal voltage UT and thus the junction temperature in real time. The objective of this study is to estimate the junction temperature even for high frequency of power cycling tests. First, the measurement method is presented, and then the test bench is described.
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