Abstract
The large mismatch in thermal expansion coefficients of silicon and the plastic encapsulants available today, introduces severe stress at the chip surface which might lead to stress-induced failures. The sensor arrays introduced here, have been designed to study the mechanical impacts/properties and moisture contents of plastic encapsulants at the chip surface. An array of piezo-resistors is used to measure the mechanical stresses at the chip surface while an array of Hall-devices is used to measure stress-induced pattern shift. Moisture measurements are carried out with help of an interdigitated finger structure.
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