Abstract
The large mismatch in thermal expansion coefficients of silicon and the plastic encapsulants available today, introduces severe stress at the chip surface which might lead to stress-induced failures. The sensor arrays introduced here, have been designed to study the mechanical impacts/properties and moisture contents of plastic encapsulants at the chip surface. An array of piezo-resistors is used to measure the mechanical stresses at the chip surface while an array of Hall-devices is used to measure stress-induced pattern shift. Moisture measurements are carried out with help of an interdigitated finger structure.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
