Abstract
The temperature of electrostatic chuck (ESC), a wafer susceptor used in semiconductor etch equipment, must accurately control the temperature of wafers during the etching process to obtain uniform and consistent process results. Failure to control the precise temperature can lead to rejection from the high-volume semiconductor manufacturing site (one of the most high-cost equipment components which can be repaired for its extended use). In this research, we propose a wireless-type on-wafer temperature monitoring system (OTMS) for easier and faster temperature monitoring to help temperature measurements of the repaired ESC in atmospheric and vacuum conditions. The proposed method, which can effectively measure the temperature distribution of the ESC, should manage the operational condition of ESC. A successful demonstration of the 300 mm size OTMS for the repaired parts enhanced the quality assurance with a temperature deviation of ±3.83 °C over 65 points of measurement.
Highlights
Condition monitoring of semiconductor equipment is becoming more important than ever due to the increased complexity of semiconductor manufacturing equipment necessary to enable fabricating nano-scale semiconductor devices
There is a correlation between the electrostatic chucks (ESC) temperature distribution and the CD map
The proposed system is manufactured with a thickness of 1.5 mm, which is the thickness of two wafers to meet the wafer handling automation requirements of semiconductor chip manufacturers
Summary
Condition monitoring of semiconductor equipment is becoming more important than ever due to the increased complexity of semiconductor manufacturing equipment necessary to enable fabricating nano-scale semiconductor devices. Even small parts can cause etching characteristic problems in advanced plasma etching processes For this reason, it is important to study electrostatic chucks (ESC) since they are closely related to the process result [8,9]. Once the repaired ESC (here R-ESC) is pretested (normally by chucking and temperature tests), it is shipped to the customer site where installation and verification are performed While this process continues, the rejected R-ESC should undergo the same repair process in order to understand the cause of temperature control failure. The rejected R-ESC should undergo the same repair process in order to understand the cause of temperature control failure It is very beneficial for ESC repair shops to have a temperature measurement system for R-ESC while the chucking test is performed in both ambient and vacuum conditions.
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