On the use of new interconnects and packaging technologies in high energy physics experiments

Abstract

At a time when H.E.P. experiments require high speed, high density, high reliability, high performances (low noise, efficient cooling …) and rather sophisticated and multifunction readout electronics, the new technologies of packaging and interconnects are being more and more in demand. This paper reviews the presently available technologies (such as fine-pitch surface mount packages, TAB technology andMCM, i.e. multichip modules), the reasons for using them in H.E.P., and gives examples of some applications being developed and the prospects.