Abstract
The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn–3.9Ag–0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.
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