Abstract
The characteristic parameters of coplanar multistrip lines embedded in multilayered lossless/lossy substrates are commonly computed by using either quasi-TEM or full-wave model. Several methods are provided in the literature to deal with this type of structure. A comparative study of quasi-TEM and rigorous solutions is carried out in order to establish criteria for the validity of the quasi-TEM approach. Reliable quasi-TEM and full-wave numerical data have been properly generated by applying an enhanced spectral domain analysis. The authors conclude that the quasi-TEM model yields satisfactory results for many MIC and MMIC practical cases. However, significant errors arise when high conductivity substrates are involved in MMIC applications. A discussion about the computation of the dynamic modal characteristic impedance is also reported, showing how the insertion of the modal orthogonality can save computational effort in a lossy multiport system. >
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