Numerical Investigation of Thermal Transport in Confined Single and Multiple Jet Impingements Through Porous Filled Non-Uniform Cross Section Channels

Abstract

Thermal management has an important role in the development of advanced electronics devices to keep the temperature below a maximum operating temperature. Some of the main electronics cooling techniques include indirect liquid cooling, natural convection plus radiation, forced air convection, and immersion cooling. Jet impingement can provide a high efficiency cooling for a variety of applications including electronics cooling. On the other hand, the utilization of porous inserts can improve the cooling effectiveness and temperature control. The porous substrate provides a very large surface area for a given volume that is a key parameter in heat transfer process. Metal foam is a type of porous material in which an interconnected system of metal filaments provides a light and high conductive substrate. In this work, single and multiple jet impingements through high conductive porous filled non-uniform channels (with inclined walls) have been simulated numerically. The base of the porous filled non-uniform channel will be in contact with the devices to be cooled; as such the base is subjected to high heat flux leaving the devices. This study indicates the importance of the channel inclined walls on the cooling effectiveness and temperature uniformity of the devices to be cooled. The effect of different heat flux values on the temperature distribution on the base is also studied. In addition, cooling performance of single jet impingement has been compared with that of multiple jet impingement for a variety of inlet channel designs. In the multiple jet impingement cases, the effect of different parameters including the thickness of the impingement jet inlet channels, their location and orientation are investigated and temperature distribution and uniformity are compared with those of single jet impingement.